Convective heat transfer from simulated air-cooled printed-circuit board assembly on horizontal or vertical orientation

JOURNAL ARTICLE published January 1998 in International Communications in Heat and Mass Transfer

Authors: C.W. Leung | H.J. Kang

NUMERICAL SIMULATION OF LAMINAR FORCED CONVECTION IN AN AIR-COOLED HORIZONTAL PRINTED CIRCUIT BOARD ASSEMBLY

JOURNAL ARTICLE published March 2000 in Numerical Heat Transfer, Part A: Applications

Conduction Heat Transfer in a Printed Circuit Board

BOOK CHAPTER published 2009 in Everyday Heat Transfer Problems: Sensitivities to Governing Variables

LAMINAR CONVECTION OF HORIZONTAL AND VERTICAL SIMULATED PRINTED-CIRCUIT BOARD ASSEMBLIES

JOURNAL ARTICLE published January 1997 in Experimental Heat Transfer

Authors: C. W. Leung | H.J. Kang

Thermal Design Optimization of the Printed Circuit Board through Area Reduction

JOURNAL ARTICLE published 9 March 2022 in Heat Transfer Engineering

Authors: Cristina Mihaela Dragan | Dorin Lelea

THERMAL ANALYSIS OF A PRINTED CIRCUIT BOARD COOLED BY FORCED CONVECTION

PROCEEDINGS ARTICLE published 1994 in Proceeding of International Heat Transfer Conference 10

Authors: U. Navon | S. Kreitenberger | Chaim Gutfinger

An Experimental Investigation of the Thermal Interaction of Electro-Optical Components on a Printed Circuit Board in Natural and Forced Convection

PROCEEDINGS ARTICLE published 1 January 2003 in Heat Transfer: Volume 3

Authors: Amy S. Fleischer | Randy D. Weinstein

Use of Printed Circuit Board as Electrode in EHD-Enhanced Condensation Experiments for a Shell/Tube Bundle Heat Exchanger

PROCEEDINGS ARTICLE published 1 January 2005 in Heat Transfer: Volume 2

Authors: J. Wu | M. M. Ohadi | S. Dessiatoun | J. Qi

Enhanced convection from horizontal printed-circuit board with lifted electronic components

JOURNAL ARTICLE published 20 February 1998 in Heat and Mass Transfer

Authors: H. J. Kang | C. W. Leung

Modeling and Validating the Transient Behavior of Flat Miniature Heat Pipes Manufactured in Multilayer Printed Circuit Board Technology

JOURNAL ARTICLE published 1 August 2011 in Journal of Heat Transfer

Authors: Wessel W. Wits | Jim B. W. Kok

NUMERICAL STUDY OF FLOW STRUCTURE AND THERMOHYDRAULIC PERFORMANCE OF SCO2 IN S-SHAPED PRINTED CIRCUIT HEAT EXCHANGER WITH LONGITUDINAL RIBS

JOURNAL ARTICLE published 2020 in Heat Transfer Research

Authors: Qi Jing | Di Zhang

Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications

JOURNAL ARTICLE published 2 January 2019 in Experimental Heat Transfer

Research funded by Turkish Ministry of Science and Technology (01464.STZ.2012-2) | Istanbul Development Agency (ISTKABIL26)

Authors: Thamer Khalif Salem | Ferina Saati Khosroshahi | Mehmet Arık | Mohammad O. Hamdan | Mete Budakli

Microheterogeneous Model of Gas-Free Combustion

JOURNAL ARTICLE published 2007 in Heat Transfer Research

Authors: A. S. Rogachev | N. A. Kochetov

OPTIMIZATION ANALYSIS OF PRINTED CIRCUIT HEAT EXCHANGER USED FOR HUMID AIR TURBINE CYCLE BY ECONOMY AND IRREVERSIBLE LOSS EVALUATION

JOURNAL ARTICLE published 2024 in Heat Transfer Research

Authors: Junlin Chen | Chen Yang | Keyong Cheng | Xunfeng Li | Xiulan Huai

Radiation Heat Exchange Between Electronic Components on a Circuit Board and the Walls of Its Enclosure

JOURNAL ARTICLE published January 1994 in Heat Transfer Engineering

Authors: WEIDA WU | YUNUS A. CENGEL

Optimal Package Design of Stacks of Convection-Cooled Printed Circuit Boards Using Entropy Generation Minimization Method

PROCEEDINGS ARTICLE published 1 January 2007 in ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1

Authors: Wen Jei Yang | Takahiro Furukawa | Shuichi Torii

Characteristic Properties of the Mathematical Modeling of the Temperature Conditions of Printed Board Assemblies under Individual Gas Soldering of Electronic Components

JOURNAL ARTICLE published 1998 in Heat Transfer Research

Authors: V. G. Sarioglo | N. M. Fialko | V. G. Prokopov

Evaluation of anisotropic tangential conduction in printed-circuit-board heated-thin-foil heat flux sensors

JOURNAL ARTICLE published December 2018 in International Journal of Heat and Mass Transfer

Research funded by Spanish State Research Agency (DPI2016-79401-R)

Authors: A.F.M. Torre | A. Ianiro | S. Discetti | G.M. Carlomagno

Editorial Board

JOURNAL ARTICLE published July 2007 in International Communications in Heat and Mass Transfer

Editorial Board

JOURNAL ARTICLE published April 2007 in International Communications in Heat and Mass Transfer